Tazasil · Silicate resin

Tazasil S, for 20–35 °C.

Cold-curing, non-foaming two-component silicate resin for processing at 20–35 °C. Gel time 35 min and curing time 120 min at 21 °C.

Cold-curing2KSilicate resinNon-foaming

Technical data

Application

Processing temperature
20–35 °C

Times at a test temperature of 21 °C

Gel time
35 min
Curing time
120 min

The times were measured at 21 °C. This is the test temperature, not the processing temperature range. Gel time is not the same as pot life.

Technical data common to all three resins

System type
Two-component silicate resin
Behaviour
non-foaming, components mix well
Mixing ratio A : B
1 : 2 (by volume)
Storage temperature
0–30 °C
Density of component A at 23 °C
1.50–1.55 g/cm³
Density of component B at 23 °C
1.24–1.25 g/cm³
Viscosity of component A at 23 °C
200–500 mPa·s
Viscosity of component B at 23 °C
300–400 mPa·s
pH of component A
alkaline
pH of component B
neutral

Values as per technical information from PS Resins.

Processing

Curing method
cold-curing
Processing temperature
20–35 °C
Mixing ratio A : B
1 : 2 (by volume)
Storage temperature
0–30 °C
  • Two-component system: components A and B are mixed at a ratio of 1 : 2 by volume.
  • Components A and B mix well; mixing different Tazasil resins is not approved.
  • Gel time and curing time apply at 21 °C. Gel time is not a pot life value.
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